Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control

摘要

The invention relates to.
A substrate carrier for holding a substrate during a processing operation, said substrate carrier comprising:
a disk-shaped block of substantially non-porous material having a first surface for mounting said substrate, a second surface, and a third substantially cylindrical surface connecting said first and second surfaces;
said first surface being substantially planar except for at least one cavity extending from said substantially planar surface into an interior portion of said substrate carrier;
a fluid communication channel extending from said cavity to either said second surface or to said third surface to communicate a fluid from a source of fluid to said cavity;
said first surface adapted to receive a flexible membrane to cover said cavity and form a chamber capable of holding a pressure when said fluid is communicated from said source of fluid to said cavity; and
said membrane expanding when said fluid is communicated under a pressure to said chamber and exerting a force on a substrate mounted to said membrane.