发明名称
摘要 An LED array head includes a circuit board and a plurality of LED array chips mounted thereon. Each of the plurality of LED array chips has a plurality of light-emitting elements aligned and exposed on a surface thereof. The plurality of LED array chips are aligned on the circuit board in a direction in which the plurality of light-emitting elements are aligned, so that the plurality of light-emitting elements lie on a single straight line. The LED array chips are bonded to the circuit board by an epoxy resin type soft adhesive.
申请公布号 JP3982932(B2) 申请公布日期 2007.09.26
申请号 JP19980352802 申请日期 1998.12.11
申请人 发明人
分类号 B41J2/44;B41J2/45;B41J2/455;H01L33/08;H01L33/22;H01L33/30;H01L33/62 主分类号 B41J2/44
代理机构 代理人
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