摘要 |
An LED array head includes a circuit board and a plurality of LED array chips mounted thereon. Each of the plurality of LED array chips has a plurality of light-emitting elements aligned and exposed on a surface thereof. The plurality of LED array chips are aligned on the circuit board in a direction in which the plurality of light-emitting elements are aligned, so that the plurality of light-emitting elements lie on a single straight line. The LED array chips are bonded to the circuit board by an epoxy resin type soft adhesive. |