| 摘要 |
<p>The arrangement has a semiconductor body (2), where a layer (11) is provided at a main surface (10) of the semiconductor body. The semiconductor body is provided for receiving an incident photon radiation, which can be detected. Another layer (21) with a conduction type is provided at another main surface (20) of the semiconductor body, where the latter surface lies far away to the former main surface. A third layer (22) has another conduction type, which is opposed to the former conduction type. The third layer is arranged between a substrate and the layer (21). Independent claims are also included for the following: (1) a method for operating a test assembly (2) a method for producing a photo detector arrangement.</p> |
