摘要 |
A three-dimensional structure including a plurality of integrated circuits (101a-d) stacked substantially vertically one on top of another, said stack of circuits (101a-d) including first and second circuits (101a;113) located at different vertical levels in the stack, wherein the first circuit comprises a master clock circuit (113) that includes clock circuitry arranged to provide clock signals to a plurality of nodes (107) within the master clock circuit, and the structure includes at least one interconnect (115) that is arranged to connect one of the nodes (107) in the master clock circuit to a node (117) in the second circuit (101a), and the master clock circuit (113) is arranged to supply clock signals to the second circuit (101a) via the interconnect (115). |