发明名称 Vertical distribution of planar signals in stacked integrated circuits
摘要 A three-dimensional structure including a plurality of integrated circuits (101a-d) stacked substantially vertically one on top of another, said stack of circuits (101a-d) including first and second circuits (101a;113) located at different vertical levels in the stack, wherein the first circuit comprises a master clock circuit (113) that includes clock circuitry arranged to provide clock signals to a plurality of nodes (107) within the master clock circuit, and the structure includes at least one interconnect (115) that is arranged to connect one of the nodes (107) in the master clock circuit to a node (117) in the second circuit (101a), and the master clock circuit (113) is arranged to supply clock signals to the second circuit (101a) via the interconnect (115).
申请公布号 GB0716055(D0) 申请公布日期 2007.09.26
申请号 GB20070016055 申请日期 2007.08.17
申请人 REGAN, TIMOTHY J 发明人
分类号 主分类号
代理机构 代理人
主权项
地址