| 发明名称 |
Transparent polishing pad |
| 摘要 |
The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a separate aperture or window in the polishing pad.
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| 申请公布号 |
US7273407(B2) |
申请公布日期 |
2007.09.25 |
| 申请号 |
US20060494434 |
申请日期 |
2006.07.27 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
SAIKIN ALAN H. |
| 分类号 |
B24B5/00;B24D99/00;B24B37/013;B24B37/20;C08K9/10;C08L101/00;H01L21/304 |
主分类号 |
B24B5/00 |
| 代理机构 |
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