发明名称 Modularized cooler
摘要 A modularized cooler includes the at least two heat radiator modules arranged in a stack, each heat radiator module having a set of radiation fins, heat-exchange tubes arranged in parallel and surrounded by the radiation fins, two locating plates holding the heat-exchange tubes in place, and a plurality of first bends and second bends respectively connected between every two adjacent heat-exchange tubes at two sides of the radiation fins and forming with the heat-exchange tubes a continuously S-shaped piping having an inlet and an outlet, and at least one connecting tubes that connect the S-shaped pipings of the heat radiator modules in series.
申请公布号 US7273092(B2) 申请公布日期 2007.09.25
申请号 US20050088742 申请日期 2005.03.25
申请人 FORWARD ELECTRONICS CO., LTD. 发明人 HUANG JUNG-FONG;HUANG CHIH-CHIEN
分类号 F28D1/047;F28D1/00;F28F1/32;F28F9/26;G06F1/20;H01L23/473;H05K7/20 主分类号 F28D1/047
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