发明名称 LAMINIERTE KONTAKTE IN SOCKEL
摘要 A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
申请公布号 AT372043(T) 申请公布日期 2007.09.15
申请号 AT20030716189T 申请日期 2003.02.25
申请人 INTEL CORPORATION 发明人 XIE, HONG;VISWANATH, RAM;PATEL, PRIYAVADAN
分类号 H05K7/10;H01L23/50;H05K1/02 主分类号 H05K7/10
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