发明名称 |
HÄRTBARE EPOXIDHARZZUSAMMENSETZUNG |
摘要 |
A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices. |
申请公布号 |
AT373046(T) |
申请公布日期 |
2007.09.15 |
申请号 |
AT20020738889T |
申请日期 |
2002.06.28 |
申请人 |
DOW CORNING TORAY CO., LTD. |
发明人 |
MORITA, YOSHITSUGU;UEKI, HIROSHI;NAKANISHI, KOJI;FURUKAWA, HARUHIKO |
分类号 |
C08K3/00;C08L63/00;C08G59/20;C08G59/62;C08L61/04;C08L61/06;C08L83/04;C08L83/06 |
主分类号 |
C08K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|