发明名称 LSI PACKAGE AND METHOD OF ASSEMBLING THE SAME
摘要 In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal terminals electrically connected to the signal input and output terminals of the circuit module, second electric terminals for electrically connecting the circuit module to the mounting board, internal wirings electrically connected to the first signal terminals, and first coupling parts electrically connected to the internal wirings. An interface module is provided with a signal transmission line for transmitting the signals and second coupling parts electrically connected to the transmission line. The second coupling part is electrically and mechanically connected to the first coupling parts, respectively.
申请公布号 KR100758396(B1) 申请公布日期 2007.09.14
申请号 KR20040010467 申请日期 2004.02.17
申请人 发明人
分类号 G02B6/42;H01L23/12;G02B6/43;H01L21/52;H01L25/16;H05K1/02;H05K3/30;H05K7/10 主分类号 G02B6/42
代理机构 代理人
主权项
地址