| 摘要 |
Through holes (231 (231A, 231B)) are formed on stamper holders 23 (23A, 23B)) at positions corresponding to the entire plane of stampers (24 (24A, 24B)). The through holes (231 (231A, 231B)) are communicated by communicating grooves (232 (232A, 232B)), and are communicated with suction holes 222 (222A, 222B)) on the both sides of temperature adjusting plates (22 (22A, 22B)). Since the stampers (24 (24A, 24B) can be held by suction over the entire plane, uplift at a center part of the stampers (24 (24A, 24B)) is prevented. Further, since the stampers 24 (24A, 24B)) well adhere to the temperature adjusting plates (22 (22A, 22B)) through the stamper holders (23 (23A, 23B)), heating and cooling efficiencies are improved.
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