Epoxy resin composition for sealing Semiconductor device and Semiconductor device Sealed therewith,申请号KR20050131438-传众专利搜索

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发明名称	Epoxy resin composition for sealing Semiconductor device and Semiconductor device Sealed therewith
摘要
申请公布号	KR100758881(B1)	申请公布日期	2007.09.14
申请号	KR20050131438	申请日期	2005.12.28
申请人		发明人
分类号	C08L63/00;C08K3/20;C08L27/18	主分类号	C08L63/00
代理机构		代理人
主权项
地址

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