发明名称 |
Dual cure b-stageable adhesive for die attach |
摘要 |
<p>Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.</p> |
申请公布号 |
HK1072067(A1) |
申请公布日期 |
2007.09.14 |
申请号 |
HK20050104927 |
申请日期 |
2005.06.13 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
KEVIN HARRIS BECKER;HARRY RICHARD KUDER |
分类号 |
C09J;C09J201/00;C08G59/40;C08J;C08J3/24;C09J5/00;C09J11/06;C09J163/00;H01L;H01L21/52;H01L21/58 |
主分类号 |
C09J |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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