发明名称 METHOD AND DEVICE FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing device which are capable of preventing particles that are objects of counting by a particle counter from occurring on the surface of a substrate for a long time after processing is finished. SOLUTION: SPM is supplied onto the surface of a substrate so as to remove a disused resist pattern from the surface of the substrate. Thereafter, pure water is supplied on the surface of the substrate so as to rinse out SPM from the surface of the substrate. Pure water attached to the substrate is removed once, and then pure water is supplied on the surface of the substrate. Even if a sulphuric acid component remains unremoved after SPM is removed by the use of pure water, the sulphuric acid component staying on the surface of the substrate is dried out when the pure water is removed once. The dried sulphuric acid component absorbs moisture quickly, so that the sulphuric acid component grows rapidly in grain diameter, and the sulphuric acid component becomes easy to separate from the surface of the substrate. Therefore, when pure water is supplied again onto the surface of the substrate, the sulphuric acid component staying on the surface of the substrate is easily eliminated. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007234813(A) 申请公布日期 2007.09.13
申请号 JP20060053702 申请日期 2006.02.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 EMOTO TETSUYA
分类号 H01L21/304;B08B3/02;B08B3/12;G03F7/42;H01L21/027 主分类号 H01L21/304
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