发明名称 ETCHING PROCESSING APPARATUS, MONITORING METHOD THEREOF, AND SELF BIAS VOLTAGE MEASURING METHOD
摘要 PROBLEM TO BE SOLVED: To estimate self bias voltage under arbitrary etching conditions with a simplified procedure. SOLUTION: A self bias voltage measuring method in an etching processing apparatus uses electrostatic suction mechanisms 1, 10 for sucking a sample 2; mechanisms 13, 14 for filling cooling gas 12 in the rear surface of the sample 2, and controlling its pressure; and means for measuring relative electrostatic suction force to the sample from a controlled state of the rear surface pressure of the sample 2 in processing. In this case, based on the controlled state of the rear surface pressure of the sample 2 when high frequency bias power is applied to the sample in processing, the relative electrostatic suction force of the sample and electrostatic suction voltage corresponding to the electrostatic suction force are acquired. Further, based on the controlled state of the rear surface pressure of the sample 2 when high frequency bias power is not applied to the sample in processing, the relative electrostatic suction force of the sample and the electrostatic suction voltage corresponding to the electrostatic suction force are acquired. Using both of the electrostatic suction force and the electrostatic suction voltage corresponding to the electrostatic suction force, the self bias voltage is estimated. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007234869(A) 申请公布日期 2007.09.13
申请号 JP20060054913 申请日期 2006.03.01
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 IKUHARA SHIYOUJI;YAMAMOTO HIDEYUKI;SHIRAISHI DAISUKE;KAGOSHIMA AKIRA
分类号 H01L21/3065 主分类号 H01L21/3065
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