SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE HANDLING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus having a configuration for suppressing inductive electrostatic charging of a substrate. SOLUTION: The substrate processing apparatus 1 is provided with a carrier holding section 2 for holding carriers C each for housing a substrate W; substrate processing units 41-44 for applying processing to the substrates W; and an indexer robot 6 and a main conveying robot 30 for conveying the substrates W between the carriers C and the substrate processing units 41-44. The substrate processing units 41-44 are each provided with a substrate holding means for holding the substrate W. The substrates W are each held in a grounded state during all periods when it is conveyed from the carriers C to the substrate processing units 41-44, when it is held in the substrate holding means, and when it is conveyed from the substrate processing units 41-44 to the carriers C. COPYRIGHT: (C)2007,JPO&INPIT