| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment capable of heating a wafer uniformly to a region near the edge. SOLUTION: The semiconductor manufacturing equipment is equipped with a reaction chamber 2 wherein a wafer 1 to be processed is to be introduced, gas supply means 3 for supplying a reaction gas into the reaction chamber 2, gas exhaust means 4 for exhausting the reaction gas out of the reaction chamber 1, holder 6 for holding the wafer 1 to be processed by the peripheral portion, rotary drive means 5 for turning the wafer 1 to be processed via the holder 6, heater 7 for heating the wafer 1 to be processed from below, and induction coil 8 for heating the holder 6 by high-frequency induction heating. COPYRIGHT: (C)2007,JPO&INPIT
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