| 摘要 |
PROBLEM TO BE SOLVED: To provide a facing target sputtering system where the damage of a substrate and a film deposited on the substrate caused by charged particles during plasma generated in sputtering can be suppressed. SOLUTION: The facing target sputtering system is equipped with: a pair of main targets 2a, 2b having sputtering faces facing each other; magnetic field generation sources 4a, 6a, 4b, 6b arranged at the positions in the vicinities of the main targets, respectively, having different polarities and generating magnetic fields vertical to the sputtering faces; an auxiliary target 2c arranged at one side face of a space 20 between the main targets; a substrate holder 10 of holding a substrate 12 arranged at the other side face of the space 20; and a power source 14 for applying voltage between the respective targets in such a manner that the electric potential of the auxiliary target is made opposite to the main targets. COPYRIGHT: (C)2007,JPO&INPIT
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