发明名称 METHOD OF MANUFACTURING LAMINATED CHIP VARISTOR
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated chip varistor capable of producing the laminated chip varistor having sufficient varistor characteristic even in the case of baking at a low temperature. SOLUTION: In the method of manufacturing the laminated chip varistor 1, mix powder obtained by mixing glass powder in the powder of a varistor material is used, so that a baking temperature in the case of baking is lowered. Moreover, in the manufacturing method, in a varistor element body obtained by baking a laminated body LS1, the quantity of Pr and Ag included in the grain boundary of grains containing ZnO as a main component is larger than the quantity of Pr and Ag included inside of the grains, high resistance in the grain boundary is obtained. Thus, the laminated chip varistor 1 having varistor characteristic sufficient for practical use is obtained even in the case of baking at a low temperature. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007234995(A) 申请公布日期 2007.09.13
申请号 JP20060056886 申请日期 2006.03.02
申请人 TDK CORP 发明人 TANAKA HITOSHI;SOMA IZURU;YOSHIDA HISAYOSHI;TAKEHANA MAKIKAZU;TAKAHASHI WATARU
分类号 H01C7/10 主分类号 H01C7/10
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