| 摘要 |
A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed, and a rear face that is on a side opposite to the active element formation face; detection electrodes formed on or above the active element formation face, detecting a remaining amount of ink by being wet in the ink; a penetration electrode penetrating a thickness direction of the semiconductor substrate; and a contact electrodes formed on or above the rear face, electrically connected to the detection electrodes via the penetration electrode, and transmitting and receiving information.
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