| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of highly precisely detecting the thickness of an electronic component even by the rotary angle position of a plurality of nozzle support bodies having a suction nozzle. <P>SOLUTION: Light emitted from the light emitting element 42 of a light emitting unit 45 is reflected against the reflection surface 44a of a reflection body 44 and received by a light receiving unit 46. The detection value is transmitted to a detection controller 111. A CPU 112 substitutes the detection value for a quintic correction formula stored in a RAM 113, i.e., the quintic correction formula corresponding to the rotary angle of the nozzle support bodies 32, and obtains the lower end level of the component in a corrected state. When the corresponding correction formula is used, the CPU 112 detects the thickness of the electronic component D, based on the detection information from the detection controller 111. <P>COPYRIGHT: (C)2007,JPO&INPIT |
