| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for printed wiring board in which an interlayer conductive portion can be formed easily at the position of a through-hole with good positioning precision. <P>SOLUTION: Conductor layers 3 and 4 are formed on the opposite sides of an insulating substrate 2, via holes 5 and 6 are provided at the identical positions of one conductor layer 3 and the insulating substrate 2, an exfoliative masking layer 10 is provided on the surface of one conductor layer 3, and an opening 12 larger than the through-holes 5 and 6 is provided in the masking layer 10. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
