| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having low thermal expansion properties by the use of which not only an abrasion loss of a drill is reduced during a drill processing of a multilayer printed circuit board, but also the connection reliability of a multilayer printed circuit board can be secured, and a prepreg as well as metal-clad laminate board using the same. SOLUTION: This resin composition is a resin composition containing: (A) a thermosetting resin; 10 to 35% by mass of (B) a silica having an average particle diameter of 0.4 to 4.5μm; and 10 to 20% by mass of (C) a metal dialkylphosphinate salt having an average particle diameter of 2.0 to 4.0μm, based on the total mass of the resin composition, wherein the total amount of the (B) and (C) components is 20 to 50% by mass, based on the total mass of the resin composition. COPYRIGHT: (C)2007,JPO&INPIT |
