| 摘要 |
PROBLEM TO BE SOLVED: To suppress occurrence of a useless wire fixing process in the manufacturing of a stacked semiconductor device. SOLUTION: The manufacturing process of a stacked semiconductor device comprises a chip inspection step (step S2) for inspecting the quality of a semiconductor chip stacked on a substrate, and performs a wire fixing step (step S4) only of an article judged that all semiconductor chips are good (Y in step S3) in the chip inspection step. Consequently, the wire fixing step is not performed for an article having a bad semiconductor chip. COPYRIGHT: (C)2007,JPO&INPIT
|
