Method and apparatus for dissipating heat from an integrated circuit

摘要

An apparatus ( 100 ) is provided for dispersing heat from an integrated circuit ( 202 ) to a heat sink ( 404 ). The apparatus ( 100 ) is formed on a nonconductive body ( 102 ) having at least two conductive surfaces ( 110, 112 ) disposed thereon. One of the conductive surfaces ( 110 ) is reflowed to a heat generating lead of the integrated circuit ( 202 ), and the other conductive surface ( 112 ) provides a surface for contacting a heat sink ( 404 ). The apparatus ( 100 ) and integrated circuit provide a package ( 200 ) which can be tape and reeled ( 300 ) for easy mounting to a printed circuit board ( 402 ) of a communication device ( 400 ).