ELECTRONIC DEVICE PACKAGE, MODULE AND ELECTRONIC DEVICE

摘要

Provided is an electronic device package or the like wherein a wiring pattern on an interposer substrate is not easily damaged in a space formed between an electronic device and an inserting substrate. The semiconductor package is a FAN-OUT type package provided with the interposer substrate (3), and the semiconductor device (1) and the inserting substrate (18) arranged on the substrate (3). The interposer substrate (3) has a wiring pattern (6) inside. The space (8) is formed between the semiconductor device (1) and the inserting substrate (18). In a region which corresponds to the space, a reinforcing means (metal film (7)) is formed for increasing strength of the wiring pattern (6).