| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a semiconductor device that secures the performance of a semiconductor element to be mounted, and has durability. <P>SOLUTION: The semiconductor device 1 comprises: a first substrate 11; the semiconductor element 2 joined to the surface of the first substrate 11; a second substrate 12 that has a scooped section 121 and is joined to the surface 11 of the first substrate so that the semiconductor element 2 is stored in the scooped section 121; and a protection film 13 provided on the surface of the second substrate 12 so that space surrounded by the first substrate 11 and the scooped section 121 is blocked. The semiconductor device 1 is manufactured by joining a second assembled substrate 42 where the second substrate 12 is arranged and formed at a first assembled substrate 41 where the first substrate 11 is arranged and formed, laminating a protective film sheet 43 onto the surface of the second assembled substrate 42, and performing full-cut dicing to the first and second assembled substrates 41, 42, and the protective sheet film 43. <P>COPYRIGHT: (C)2007,JPO&INPIT |
