发明名称 METHOD OF DIVIDING WORK AND METHOD OF DIVIDING LAMINATION SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To properly divide a work by a simple structure without causing chipping, crack-off or the like. <P>SOLUTION: The work WS is divided by forming a scribe groove 2 on the thin plate-like work WS having brittleness to position on a dividing line 1, applying a paste like break medium 3 having higher thermal expansion coefficient than that of the work WS on the formed scribe groove 2, curing the applied break medium 3 and heating the cured break medium 3 to utilize the expansion force of the break medium 3. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007230818(A) 申请公布日期 2007.09.13
申请号 JP20060053970 申请日期 2006.02.28
申请人 SEIKO EPSON CORP 发明人 MIYANO HIROYUKI
分类号 C03B33/033;B28D5/00;C03B33/027;C03B33/09;G02F1/13;G02F1/1333;H01L21/301 主分类号 C03B33/033
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