| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board device wherein a mounting circuit can be reinforced without providing a bump not related to circuit operation on a bonding surface, the combined use with other reinforcing technology can be eased, and a highly reliable mounting circuit can be reinforced; and to provide a circuit part reinforcing method and an electronic device which is expected to stably operate against impact, vibration, etc. during carrying. <P>SOLUTION: A conductor pattern 22a formed on the side surface of a substrate 20 and reinforcing pads 15 provided around the substrate mounting surface of a mother board 10 are bonded by solder 40, and the solder bonded part functions as a reinforcing structure of the substrate 20. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
