| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin film electronic component capable of obtaining the component with fully prevented occurrence of short-circuiting. SOLUTION: The manufacturing method of the thin film electronic component 100 includes a thin film electronic element forming step of forming a thin film electronic element 40 having electrode layers 31 and 32 on a first principal plane 10a of a substrate 10, an alignment mark forming step of forming an alignment mark 70 corresponding to the element 40 on a second principal plane 10b, a through-hole forming step of forming through-holes 52 and 53 passing through the substrate 10 and the electrode layers 31 and 32 from the second principal plane 10b, and so on. The method includes a grinding step of grinding the second principal plane 10b before the through hole forming step. COPYRIGHT: (C)2007,JPO&INPIT
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