| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide precursor composition which can be subjected to a thermal setting treatment at low temperature to form a polyimide film, and to realize an electronic part or a liquid crystal element which has a polyimide film excellent in dielectric constant characteristics, moisture resistance and environment-resistant stability, enables high speed operation and power saving, and has high reliability. SOLUTION: This polyimide precursor composition is characterized by comprising only an organic polar solvent used for synthesizing a polyamic acid, the polyamic acid having repeating units represented by the general formula (PA), and a curing accelerator which accelerates the curing of the polyamic acid and is compounded in an amount of 0.5 to 2.5 mole equivalent per mole equivalent of the repeating unit of the polyamic acid. The curing accelerator is at least one selected from the group consisting of compounds (AC3) obtained by substituting a specific aromatic ring compound with at least two hydroxyl groups. COPYRIGHT: (C)2007,JPO&INPIT
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