发明名称 Shared contact structures for integrated circuits
摘要 In one embodiment, a shared contact structure electrically connects a gate, a diffusion region, and another diffusion region. The shared contact structure may comprise a trench that exposes the gate, the diffusion region, and the other diffusion region. The trench may be filled with a metal to form electrical connections. The trench may be formed in a dielectric layer using a self-aligned etch step, for example.
申请公布号 US2007210339(A1) 申请公布日期 2007.09.13
申请号 US20060372293 申请日期 2006.03.09
申请人 NARASIMHAN GEETHAKRISHNAN;BANACHOWICZ BARTOSZ;KAPRE RAVINDRA 发明人 NARASIMHAN GEETHAKRISHNAN;BANACHOWICZ BARTOSZ;KAPRE RAVINDRA
分类号 H01L29/76;H01L21/8234 主分类号 H01L29/76
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