SUBSTRATE TREATING DEVICE SYSTEM

摘要

Provided is a substrate treating system capable of facilitating setting of an operation right in a plurality of substrate treating devices and a managing device. The substrate treating system (300) includes a plurality of substrate treating devices (100) for treating a wafer (200) and a managing device (302) connected to the substrate treating devices (100) via a communication line (308). The managing device (302) includes a display screen (350) for setting an operation right to operate the managing device (302) and each of the substrate treating devices (100) which can communicate with the managing device (302) for each of the users.