发明名称 |
METHOD AND APPARATUS FOR COOLING SEMICONDUCTOR CHIPS |
摘要 |
<p>A cooling apparatus for cooling a heat-generating chip mounted in a socket on a circuit board, the socket including a cradle having a standard heat-sink receiving configuration, includes an evaporator having a thermally conductive front face, a compressor in fluid communication with the evaporator for delivering refrigerant thereto, and an evaporator mount for coupling the evaporator to the heat-generating chip with the front face adjacent thereto. The mount includes a housing having coupling elements for connection to the cradle. The housing has an interior in which a housing insulation pack is provided for retaining the evaporator therein. The mount further includes a cradle insulation pack for maintaining the socket in moisture-free condition.</p> |
申请公布号 |
WO2007101320(A1) |
申请公布日期 |
2007.09.13 |
申请号 |
WO2006CA00840 |
申请日期 |
2006.05.23 |
申请人 |
BLUE ZONE 40 INC.;LENHARDT, RONALD, ROBERT, JAMES |
发明人 |
LENHARDT, RONALD, ROBERT, JAMES |
分类号 |
H01L23/46;H01L23/40 |
主分类号 |
H01L23/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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