发明名称 LASER BEAM MACHINING METHOD AND APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and an apparatus capable of machining a wide region of a workpiece without moving it while the increase in the size of the apparatus is suppressed. <P>SOLUTION: A laser marking apparatus 1 is designed such that a scanning unit 20 is made rotatable around the center axis of a connecting member 30 relative to a laser light source unit 10. When the scanning unit 20 is rotated, the irradiation direction (lens center axis direction of an fθlens 25) of a laser beam L from the scanning unit 20 is changed and, accordingly, a finite printing area E moves on a workpiece W. In other words, the position of the printing area on the workpiece W is moved in accordance with each rotational angle of the scanning unit 20 for the laser light source unit 10, making it possible to print a marking pattern with a size exceeding the printing area E on the workpiece W. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007229744(A) 申请公布日期 2007.09.13
申请号 JP20060052839 申请日期 2006.02.28
申请人 SUNX LTD 发明人 MATSUI SHINJI
分类号 B23K26/08;B23K26/04;B23K26/073 主分类号 B23K26/08
代理机构 代理人
主权项
地址