| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip wherein foreign matters (cutting scrap and cooling wash water) are prevented from entering in the wafer when the wafer is separated by cutting the chip into a plurality of chips, with high throughput and at a low cost. <P>SOLUTION: In a dividing method for wafer, a seal film SF is stuck on a surface 16b of a cap 16, and the wafer 20 is, with a rear surface 10a thereof turning upward, cut from the rear surface 10a side by a rapidly spinning dicing blade DB, and an incising part 10f is formed along a to-be-cut line Ka, and then the seal film SF is removed from the surface 16b of the cap 16. In this instance, the wafer 10 is not completely separated by cutting in its thickness direction, only a portion g of a specified thicknessτfrom the surface 10b of the wafer 10 is not cut to leave. The widthρof the incising part 10f is almost equal to the thickness of the dicing blade DB. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
