发明名称 |
HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER |
摘要 |
A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01 to 10 mm. The heat-curable resin (A) preferably includes a carboxyl group-containing polyurethane and a heat-curable component. The carboxyl group-containing polyurethane is obtained by reacting a polyisocyanate compound (a), a polyol compound (b) (other than compound (c)), and a carboxyl group-containing dihydroxy compound (c). |
申请公布号 |
WO2007043536(A3) |
申请公布日期 |
2007.09.13 |
申请号 |
WO2006JP320233 |
申请日期 |
2006.10.04 |
申请人 |
SHOWA DENKO K.K.;KIMURA, KAZUYA;UCHIDA, HIROSHI |
发明人 |
KIMURA, KAZUYA;UCHIDA, HIROSHI |
分类号 |
C08L75/04;C08G18/32;C08K5/54;C08K7/00;C08K7/10;C08K7/16;C08L63/00;C08L83/04;C08L101/00;C09D11/02;C09D11/10;C09D11/102;H01L23/29;H01L23/31;H05K1/03;H05K3/28 |
主分类号 |
C08L75/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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