| 摘要 |
<p>A method for fabricating a semiconductor device in which fabrication efficiency of the semiconductor device is enhanced by managing a photoresist process well. The method for fabricating a semiconductor device comprises a step for forming a photoresist film on a semiconductor substrate, a step for exposing the photoresist film under different exposure conditions for every shot by using a mask in which a predetermined pattern for evaluating process is formed, a step for forming a photoresist structure on the semiconductor substrate by developing the photoresist film under predetermined conditions, a step for irradiating the surface of the semiconductor substrate on which the photoresist structure is formed with an electron beam, a step for measuring a substrate current generated in the semiconductor substrate through irradiation with an electron beam, and a step for calculating a process window from the waveform of the substrate current.</p> |
