| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology of enhancing a work efficiency at joining and preventing the occurrence of exfoliation and quality deterioration in joined parts by suppressing an inner pressure in a semiconductor package from being suppressed at a high temperature due to reflow or the like. <P>SOLUTION: A substrate 30 and a resin frame 38 surrounding a semiconductor element in this semiconductor package are adhered by a first adhesion sheet 42. The resin film 38 and a transparent lid 40 are adhered by a second adhesion sheet 44. An opening 38a is provided on a part of the resin frame 38 facing the semiconductor element 34. An inner face 38d from an inner end 38c of a lower side 38b to an opening edge of the opening 38a is formed tilted inwardly. A liquid droop can be prevented by using the first adhesion sheet 42 and the second adhesion sheet 44. A side face form of a truncated pyramid or a truncated cone is adopted for the inner face 38d. The inner face form forms an optimum space for housing the semiconductor element. <P>COPYRIGHT: (C)2007,JPO&INPIT |
