| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an inexpensive semiconductor device, and to provide a manufacturing apparatus capable of manufacturing a semiconductor device inexpensively. <P>SOLUTION: The apparatus for manufacturing the semiconductor device comprises: a jig 103 having holders 104 arranged in a row; a control means 100 for controlling the pitch of the holders 104 arranged in a row; a support means 101 provided with multiple semiconductor integrated circuits 102; and a support means 114 provided with a substrate 111 having multiple elements 112. By mounting the semiconductor integrated circuits 102 on the respective elements 112 with the jig 103 having the holders 104 arranged in a row, semiconductor devices are manufactured. In a single process, the multiple semiconductor integrated circuits 102 can be picked up and mounted on the multiple elements 112 respectively to produce multiple semiconductor devices. This method reduces cycle time and increases mass productivity, thus allowing a low-cost semiconductor device to be manufactured. <P>COPYRIGHT: (C)2007,JPO&INPIT |
