SEMICONDUCTOR INTEGRATED DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit capable of improving its degree of integration, improving assembly reliability, and unifying electrical characteristics.

SOLUTION: The semiconductor integrated circuit is formed along a first chip side in a semiconductor chip 1 on the semiconductor chip 1, and has a plurality of circuit cells 16A with a pad 8 each. At least one circuit cell 16A positioned close to at least an edge in the first chip side in the plurality of circuit cells 16A is arranged in steps in a direction separated from the first chip side closer to the edge from the center in the first chip side.

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