| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum treatment system which does not cause warping or cracking in a substrate when treating the substrate in an unloading chamber, and to provide a venting method. SOLUTION: The vacuum treatment system comprises: a vacuum treatment chamber for treating a substrate in a decompressed environment and a high-temperature condition; the unloading chamber for receiving the substrate which has been treated in the vacuum treatment chamber, in the decompressed environment, cooling the substrate while returning it under atmospheric pressure, and transporting the substrate to the outside; and a refrigerant-discharging unit for discharging a refrigerant into the unloading chamber. The refrigerant-discharging unit spouts the refrigerant to the substrate of the unloaded chamber from the both sides of a front surface and a back surface. The refrigerant is spouted to different positions within the substrate between the front surface and the back surface. COPYRIGHT: (C)2007,JPO&INPIT
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