发明名称 |
ELECTROLESS COBALT-CONTAINING LINER FOR MIDDLE-OF-THE-LINE (MOL) APPLICATIONS |
摘要 |
A semiconductor structure that includes a Co-containing liner disposed between an oxygen-getter layer and a metal-containing conductive material is provided. The Co-containing liner, the oxygen-getter layer and the metal-containing conductive material form MOL metallurgy where the Co-containing liner replaces a traditional TiN liner. By "Co-containing" is meant that the liner includes elemental Co alone or elemental Co and at least one of P or B. In order to provide better step coverage of the inventive Co-containing liner within a high aspect ratio contact opening, the Co-containing liner is formed via an electroless deposition process.
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申请公布号 |
US2007210448(A1) |
申请公布日期 |
2007.09.13 |
申请号 |
US20060308186 |
申请日期 |
2006.03.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WONG KEITH K.H.;WANG YUN-YU;WILDMAN HORATIO S.;PARKS CHRISTOPHER C.;YANG CHIH-CHAO |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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