GOLD-BUMPED INTERPOSER FOR VERTICALLY INTEGRATED SEMICONDUCTOR SYSTEM

摘要

A semiconductor system enabled by an interposer (101) with non-reflow metal studs (251), preferably gold, coated with reflow metals (252), preferably solder. The studs are on exit ports (220) of the interposer surface; selected exit ports may be spaced apart by less than 125 µm center to center. A first electrical device (102), such as one or more semiconductor chips with contact pads matching the locations of the interposer exit ports, contacts the studs on one interposer surface. A second electrical device, such as a semiconductor chip, a passive component, or both, is attached to the other interposer surface. A carrier supports the first device and provides electrical connections to external parts.