SUBSTRATE CLEANING APPARATUS AND METHOD

摘要

A substrate cleaning apparatus and method are provided to remove efficiently organic materials from a substrate without the use of chemicals by using a water vapor spraying unit and a physical power endowing unit. A substrate cleaning apparatus includes a transfer unit, a water vapor spraying unit and a physical power endowing unit. The transfer unit(1) is used for transferring a substrate. The water vapor spraying unit(5) is used for spraying a heated water vapor onto a substrate, wherein the surface of the substrate is attached with unwanted organic materials. The physical power endowing unit(6) is used for endowing the unwanted organic materials of the substrate with a physical power. A shower capable of spraying a pressurized cleaning solution is used as the physical endowing unit.