发明名称 METHOD FOR PRODUCTION OF HEAT INSULATING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for producing a heat insulating board, wherein lowering of a temperature in a bath can be much more suppressed and keeping a space for storing a cover becomes easy by reducing thickness and weight under maintaining a heat insulation property at the same level or higher than the so far conventional one and also maintaining rigidity with no deformation. <P>SOLUTION: The dies 26 is moved to the combining direction, whereby the sheet like resin 22 containing a vacuum heat insulating material 1 is held in a cavity formed in the die under combined state. Air is introduced from a nozzle 27, whereby softened sheet like resin 22 is expanded to the outer direction and pressed to the inner surface of the cavity of the die to form a heat insulating board having a predetermined shape. In this stage, a hot-melt adhesive 25 is previously coated on a surface of the vacuum heat insulating material 1, and thus the sheet like resin 22 and the vacuum heat insulating material 1 are adhered to each others. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007230228(A) 申请公布日期 2007.09.13
申请号 JP20070017457 申请日期 2007.01.29
申请人 MAG:KK 发明人 KUBONIWA SEIICHI
分类号 B29C49/20;A47K3/00;B29C49/04;B65D1/00;B65D81/38;F16L59/06;F16L59/10 主分类号 B29C49/20
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