摘要 |
The invention relates to partially aromatic, partially crystalline thermoplastic polyamide moulding compounds containing: A) between 40 and 100 wt. % of a copolyamide consisting of a1) between 30 and 44 mol % of units derived from terephthalic acid, a2) between 6 and 20 mol % of units derived from isophthalic acid, a3) between 42 and 49.5 mol % of units derived from hexamethylene diamine, and a4) between 0.5 and 8 mol % of units derived from aromatic diamines having between 6 and 30 C atoms, the mol percentage of constituents a1) to a4) amounting to 100; B) between 0 and 50 wt % of a fibrous and particulate filler; C) between 0 and 30 wt. % of a rubber-elastic polymer; and D) between 0 and 30 % of other additives and auxiliary products, the weight percentage of constituents A) to D) amounting to 100. |
申请人 |
BASF AKTIENGESELLSCHAFT;DESBOIS, PHILIPPE;BLINNE, GERD;NEUHAUS, RALF;STAWITZKI, HAGEN;WEIS, HANS-JOACHIM |
发明人 |
DESBOIS, PHILIPPE;BLINNE, GERD;NEUHAUS, RALF;STAWITZKI, HAGEN;WEIS, HANS-JOACHIM |