ELECTRONIC ASSEMBLY HAVING GRADED WIRE BONDING

摘要

According to one aspect of the present invention, an electronic (10) assembly is provided. The electronic assembly comprises a substrate (12) with a lead (14, 16) connected thereto and first (34) and second microelectronic (36) components on the substrate. The first microelectronic component (34) has first and second portions. A plurality of conductors (44) interconnects the first microelectronic component (34) and a selected one of the lead and the second microelectronic component (36). A first of the conductors contacts the first portion of the first microelectronic component and has a first inductance, and a second of the conductors contacts the second portion of the microelectronic component and has a second inductance. The second inductance is greater than the first inductance.