| 摘要 |
An etching apparatus is provided to correspond to PCB's(printed circuit boards) of various models by increasing a control factor of an etching apparatus. A first manifold(10) is separated from one surface of a substrate(1) by a predetermined distance, including a plurality of nozzles for injecting etchant to the surface of the substrate. A first oscillation cam(20) makes the first manifold reciprocate a predetermined stroke distance, coupled to the first manifold. A first drive axis(30) transfers rotation force, coupled to the first oscillation cam. A first oscillation motor(40) applies driving force to the first drive axis. A second manifold(12) is separated from the other surface of the substrate by a predetermined distance, including a plurality of nozzles(11) for injecting etchant to the surface of the substrate. A second oscillation cam(22) makes the second manifold reciprocate a predetermined stroke distance, coupled to the second manifold. A second drive axis(32) transfers rotation force, coupled to the second oscillation cam. A second oscillation motor(42) applies driving force to the second drive axis. A first control part controls the operation and rotation speed of the first oscillation motor. A second control part controls the operation and rotation speed of the second oscillation motor.
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