发明名称 BLOW MOLDED CONTAINER WITH NON-CONTACT IC TAG
摘要 <P>PROBLEM TO BE SOLVED: To provide a blow molded container with a non-contact IC tag capable of preventing in advance the non-contact IC tag from being broken, and reliably avoiding communication interruption. <P>SOLUTION: The blow molded container 1 having a cylindrical barrel 4 and a bottom and molded by a blow molding method comprises a storing recessed part 7 formed on the outer surface of the barrel 4, the non-contact IC tag 8 provided on the storing recessed part 7, and a label 9 covered on the barrel 4 including the storing recessed part 7 for storing at least the non-contact IC tag 8. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007230644(A) 申请公布日期 2007.09.13
申请号 JP20060058272 申请日期 2006.03.03
申请人 DAINIPPON PRINTING CO LTD 发明人 TAKAZAWA KAZUYUKI
分类号 B65D25/20;B65D1/02;B65D23/08;B65D25/36;G06K19/07 主分类号 B65D25/20
代理机构 代理人
主权项
地址