| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module having an external connection terminal capable of bonding an external electrode to the external connection terminal by ultrasonic bonding without trouble. SOLUTION: The semiconductor module 10 comprises: an electronic component 12, such as a semiconductor device; and planar external connection terminals 13, 14 of which one end side is connected to the electronic component 12 electrically. The external connection terminals 13, 14 pass through a support section 15 made of resin provided at the upper portion of a base section 11 where the electronic components 12 are arranged, a part at the upper portion of the support section 15 is extended along the upper surface of the support section 15, and the tip is bent toward the side of the base section 11. The external connection terminals 13, 14 are fixed to the support section 15 while the tip is being buried to the support section 15. COPYRIGHT: (C)2007,JPO&INPIT |
